2011年1月24日 10:30 张江校区微电子楼369 学术报告

发布时间:2011-01-24 

专用集成电路与系统国家重点实验室系列讲座之一

 

题目:Design for Manufactuability and Reliability in beyond-22nm CMOS and 3D-IC Integration

报告人:David Z. Pan (Department of Electrical and Computer Engineering)

时间:2011年1月24日(周一)上午10:30-11:30

地点:张江校区微电子楼369

 

 

Abstract

In this talk, I will present some recent research results on design for manufacturability (DFM) and reliability (DFR) in beyond-22nm CMOS and 3D-IC integration by my group (www.cerc.utexas.edu/utda). On DFM, I will present some recent works on lithography hotspot detections using machine learning, double patterning lithography, and emerging nanolithography.  On DFR, I will present some recent results addressing NBTI and stress effects. For 3D-ICs, through silicon vias (TSV) cause thermal-mechanical stress, electromigration, and reliability issues. I will summarize some key activities for the 3D-IC integration.

 

Biography

David Z. Pan is currently an Associate Professor (with tenure) at the Department of Electrical and Computer Engineering, University of Texas at Austin, where he directs the UT Design Automation (UTDA) Lab. He received his Ph.D. in computer science (with honor) from UCLA in 2000. He was a Research Staff Member at IBM T. J. Watson Research Center from 2000 to 2003. His research is mainly focused on design for manufacturing/reliability, nanometer physical design, intersection of physical and system-level co-design, and CAD for emerging technologies. He holds 8 U.S. patents and has published over 140 technical papers in premier journals and international conferences. He has served as an Associate Editor for IEEE Transactions on CAD, IEEE Transactions on VLSI, IEEE Transactions on CAS-I, IEEE Transactions on CAS-II, IEEE CAS Society Newsletter, and Journal of Computer Science and Technology. He has served as the IEEE CANDE Committee Chair, ACM/SIGDA Physical Design Technical Committee Chair, committee member of major VLSI/CAD conferences, including DAC (Track Chair), ICCAD, DATE, ASPDAC (Track Chair), ISPD (Program/General Chair), ISCAS (CAD Chair), VLSI-DAT (EDA Chair), ISQED (Topic Chair), ACISC (Program/General Chair), GLSVLSI (Publicity Chair), ISLPED (Exhibits Chair), SLIP (Publication Chair), and so on.  He is a member of the International Technology Roadmap for Semiconductor (ITRS) and a Technical Advisory Board member of Pyxis Technology, Inc.

 

He has received a number of awards for his research contributions and professional services, including ACM/SIGDA Outstanding New Faculty Award, NSF CAREER Award, UCLA Engineering Distinguished Young Alumnus Award, IBM Faculty Award four times, SRC Inventor Recognition Award three times, Best Paper Award at ASPDAC 2010, Best IP Award at DATE 2010, ACM Recognition of Service Award twice, Best Student Paper Award at ICICDT 2009, Best Paper In Session Award at SRC Techcon (1998 and 2007), ISPD 2007 Global Routing Contest Awards, eASIC Placement Contest Grand Prize (2009), and a number of Best Paper Award Nominations at premier conferences such as ASPDAC, DAC, ICCAD, and ISPD. He is an IEEE CAS Society Distinguished Lecturer for 2008–2009.