Department of Mechanical Science and Engineering
University of Illinois at Urbana-Champaign

Time & Date: 14:00, June 15, 2012
Place: Room 138 , Physics Building

Abstract:

The increasing device density in IC has led to exponential growth in the density of interconnects and the complexity of their design.  With the introduction of three-dimensional (3D) chip architecture, interchip vias constitute one method to integrate devices in 3D stacks, but alternative interconnect technologies that can provide flexible means to electrically wire microscale device components in three dimensions are still required. In this talk, we introduce a “direct-write” method for metal wires to demonstrate an automated wire-bonding process that enabled Cu and Pt wire diameters of less than 1 micrometer and bond sizes of less than 3 micrometers, with a breakdown current density of more than 1011 amperes per square meter for the wire bonds.  This new technology thus provides a brand new route to downscale interconnects to very fine pitches on the order of a few micrometers.  In addition, the technology makes possible many new strategies for fabricating ultra-high-density and high-quality 3D microscale and nanoscale structures with designed structural and device functionalities.

Biography

Min-Feng Yu (俞敏峰) is a Full Professor in the School of Aerospace Engineering at Georgia Institute of Technology, and prior to that an Associate Professor of Mechanical Science and Engineering in University of Illinois at Urbana-Champaign.  He received his B.S., M.S and Ph.D. degrees in Physics from University of Science and Technology of China, Fudan University, and Washington University in St. Louis, respectively.  He is the author of over 65 peer-reviewed journal articles (with over 5000 citations) contributing to the fundamental understanding of nanoscale mechanical and electromechanical phenomenon and the involved systems.  His research interests span from understanding basic mechanics and physics of materials to the nanomanufacturing of related nanoscale devices and systems.  He holds 13 issued and pending US and international patents on the related development.