CMP application in wafer thinning and 3D structures

Speaker: Dr. Knut Gottfried (TUC)

Time and Date: 10:30-11:30, Nov. 5, 2013

Place: Room 205, Guanghua Building, Handan Campus

Abstract

This talk will be related to recent research and development of CMP application in wafer thinning and 3D structures.

Biography

Knut Gottfried received his Diploma degree in electrical engineering from Chemnitz University of Technology (TUC), Germany in 1993. Following he started as research engineer at the Chemnitz University Center for Microtechnologies. There he was mainly involved in research dealing with interconnect systems for ICs and MEMS. Among others, he was responsible for the development of interconnect schemes for sensor applications operating at temperatures up to 500 °C. The results of this work he summarized in his Ph.D. thesis in 2004. In 2001 Knut moved to Fraunhofer where he took over responsibility for CMP and thinning technologies. Besides that, he is senior scientist for 3D-integration related research and development as well as deputy head of the department “Back-end of line”. Knut is an active member of the German/European CMP user group and member of the program committee of the “International Conference on Planarization/CMP Technology – ICPT”